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Again in October 2023, Ming-Chi Kuo reported that Apple was exploring using resin-coated copper (RCC) parts for the iPhone’s logic board in an effort to save lots of area inside as the skin thickness was decreased. Nevertheless, a brand new report from the identical supply claims that gained’t be taking place in any case.
In a submit on X (previously Twitter), Kuo says Apple gained’t be utilizing the brand new materials within the iPhone 17 resulting from provider Ajinomoto’s “incapability to satisfy Apple’s high-quality necessities.” In October, Kuo reported that if Ajinomoto might enhance the RCC materials earlier than the third quarter of this 12 months, Apple would use it in “the 2025 new high-end iPhone 17 fashions.”
The brand new high-end iPhone 17 is rumored to be a slimmer mannequin with a bigger display measurement and a brand new design. Using RCC was presumably one of many methods Apple was in a position to make the telephone thinner, as Kuo explains that RCC “can scale back the thickness of the mainboard (i.e., it might save inside area) and make the drilling course of simpler as a result of it’s fiberglass-free.”
Kuo doesn’t speculate whether or not the shift modifications Apple’s plan for the iPhone 17, however with far much less inside area than an iPad or Mac, it might drive Apple to pivot to a unique plan whereas delaying the brand new slimmer iPhone mannequin to 2026.
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