Qualcomm is spitting out XR2 chips quicker than VR headsets can use them

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What it’s worthwhile to know

  • Qualcomm is allegedly sending new XR2 and XR2+ Gen 3 chips out to VR HMDs.
  • These “Undertaking Matrix” chips supposedly assist 16GB of RAM, UFS 4.0 storage, and 4K screens and will use Oryon CPUs.
  • The Snapdragon XR2+ Gen 2 was introduced in early January and has but to be featured in client merchandise.

Qualcomm reportedly has begun testing and lending out its Snapdragon XR2 Gen 3 and XR2+ Gen 3 chips, designed for the following technology of VR headsets. This leaked information shocked us, on condition that one Gen 2 chip hasn’t entered shoppers’ fingers but.

WinFuture’s Roland Quandt first posted on X about “Undertaking Matrix,” the corporate’s “next-gen AR/VR chips,” on Might 17. Particularly, he defined how the higher-end SXR2350 will assist 16GB of RAM, UFS 4.0 storage, and 4K screens. 



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